november 2010 ? 2010 fairchild semiconductor corporation www.fairchildsemi.com fsusb63 ? rev. 1.0.2 fsusb63 ? 3:1 high-speed usb 2.0 switch / multiplexer fsusb63 ? 3:1 high-speed usb 2.0 switch / multiplexer features switch type 3:1 usb switch usb usb 2.0 high-speed & full-speed compliant break-before-make time 126s r on 6 ? typical c on 6pf typical bandwidth 830mhz v cc 2.7 to 4.4v v cntrl 0 to v cc operating temperature -40c to 85c i ccslp <1a i cc a ct 7.5a typical package 12- lead umlp 1.80 x 1.80 x 0.55mm, 0.40mm pitch top mark kg ordering information FSUSB63UMX applications ? cell phone, digital camera, notebook ? lcd monitor, tv, and set-top box ? netbook, mobile internet device (mid) description the fsusb63 is a bi-directional, low-power, high-speed (hs) usb 2.0 3:1 multiplexer (mux). it is optimized for switching among three high-speed (480mbps) sources or any combination of high-speed and full-speed (12mbps) usb sources, such as an application processor, to one usb 2.0 connector. the fsusb63 has a break-before-make time to force re- enumeration by the host when switching between different hs usb 2.0 controllers and thus requires minimal software changes. the fsusb63 is compliant with the requirements of usb 2.0 and features extremely low on capacitance (c on ). the wide bandwidth exceeds the requirement to pass the third harmonic, resulting in signals with minimum edge and phase distortion. superior channel-to-channel crosstalk also minimizes interference. related resources ? for samples and questions, please contact: analog.switch@fairchildsemi.com . ? fsusb63 demonstration board typical application figure 1. analog symbol
? 2010 fairchild semiconductor corporation www.fairchildsemi.com fsusb63 ? rev. 1.0.2 9 fsusb63 ? 3:1 high-speed usb 2.0 switch / multiplexer do not distribute physical dimensions figure 17. 12-lead, ultrathin molded leadless package (umlp) ordering information part number top mark operating temperature range package FSUSB63UMX kg -40 to +85c 12-lead, quad, ultrathin molded leadless package (umlp), 1.8mm x 1.8mm x 0.55mm, 0.4mm pitch package drawings are provided as a service to customers considering fairchild components. drawings may change in any manner wit hout notice. please note the revision and/or date on the drawing and contact a fairchild semiconductor representative to verify or o btain the most recent revision. package specifications do not expand the terms of fairchild?s worldwide terms and conditions, specifically the warranty therein, which covers fairchild products. always visit fairchild semiconductor?s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ .
? 2010 fairchild semiconductor corporation www.fairchildsemi.com fsusb63 ? rev. 1.0.2 10 fsusb63 ? 3:1 high-speed usb 2.0 switch / multiplexer
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